Loading...
Flux Gel 1,4cm3 AG CHEMIA AGT-047
Recommended
Flux gel - RMA class, capacity 1.4 cm3, thickened rosin flux, No-clean technology (no washing required after soldering), ready to print for 36 hours, retains stickiness for 72 hours, suitable for mounting and repairing SMT components (BGA, SOP, PLCC, SMD), application of nets, with a stencil or syringe, optimal solderability on Ag, Cu, Au, Zn, Cd and SnPb surfaces
In stock more than 50 pcs
Expected shipping:
24.09.2026
Regular price
115,00 Kč
95,04 Kč
excl. VAT
Unit price
/
Unavailable
OEM | SKU:
06560557
Product description
Flux / Flux gel 1.4cm3 AG Chemia
Flux / gel is a concentrated rosin flux of RMA class, designed for installation and repair of SMT elements (BGA, SOP, PLCC, SMD)
The flux / gel can be applied via a sieve, a template or from a syringe.
The activators used for the production of the flux make it possible to leave its residues after soldering (if the process does not involve a washing phase).
Best solderability on surfaces: Ag, Cu, Au, Zn, Cd and SnPb
Properties
Does not require washing after soldering ,, No-clean ,,
Ready to print: 36 hours
Retains tack for up to 72 hours
Specifications
Package content 1.4cm3
Manufacturer AG Thermopasts
Flux / gel is a concentrated rosin flux of RMA class, designed for installation and repair of SMT elements (BGA, SOP, PLCC, SMD)
The flux / gel can be applied via a sieve, a template or from a syringe.
The activators used for the production of the flux make it possible to leave its residues after soldering (if the process does not involve a washing phase).
Best solderability on surfaces: Ag, Cu, Au, Zn, Cd and SnPb
Properties
Does not require washing after soldering ,, No-clean ,,
Ready to print: 36 hours
Retains tack for up to 72 hours
Specifications
Package content 1.4cm3
Manufacturer AG Thermopasts
