Solder paste for SMD XG-Z40 35g (10ml), composition Sn63Pb37
Soldering paste for SMD - type XG-Z40, composition Sn63Pb37, melting point 183°C, grain size 25–45µm, No Clean type flux without the need for cleaning after soldering, 35 g pack in a syringe for precise dosing, suitable for soft reflow and hand soldering of SMD components on PCBs, keep the container closed, store in a cool place
In stock 17 pcs
Expected shipping:
30.09.2026
Regular price
2.505 Ft
1.972 Ft
excl. VAT
Unit price
/
Unavailable
HADEX | SKU:
08740138
Product description
Soldering tin paste for SMD soft soldering.
Keep the package closed when not using the paste.
Technical parameters:
- composition: Sn63Pb37
- packaging: syringe
- weight: 35g
- type of flux: No Clean
- melting point: 183°C
- grain size 25...45µm
Keep the package closed when not using the paste.
Technical parameters:
- composition: Sn63Pb37
- packaging: syringe
- weight: 35g
- type of flux: No Clean
- melting point: 183°C
- grain size 25...45µm
